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| TPCS8004 TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (-MOSV) TPCS8004 High-Speed Switching Applications Switching Regulator Applications DC-DC Converter Applications * * * * * Small footprint due to small and thin package Low drain-source ON resistance: RDS (ON) = 0.56 (typ.) High forward transfer admittance: |Yfs| = 1.8 S (typ.) Low leakage current: IDSS = 100 A (max) (VDS = 200 V) Enhancement model: Vth = 1.5 to 3.5 V (VDS = 10 V, ID = 1 mA) Unit: mm Absolute Maximum Ratings (Ta = 25C) Characteristics Drain-source voltage Drain-gate voltage (RGS = 20 k) Gate-source voltage Drain current DC (Note 1) Symbol VDSS VDGR VGSS ID IDP PD PD EAS IAR EAR Tch Tstg Rating 200 200 20 1.3 5.2 1.5 W 0.6 1.05 1.3 0.15 150 -55 to 150 mJ A mJ C C Unit V V V JEDEC A 2-3R1B Pulse (Note 1) JEITA TOSHIBA Drain power dissipation (t = 10 s) (Note 2a) Drain power dissipation (t = 10 s) (Note 2b) Single pulse avalanche energy (Note3) Avalanche current Repetitive avalanche energy (Note2a, Note 4) Channel temperature Storage temperature range Weight: 0.035 g (typ.) Circuit Configuration 8 7 6 5 Note 1, Note 2, Note 3 and Note 4: See the next page. This transistor is an electrostatic-sensitive device. Please handle with caution. 1 2 3 4 1 2009-09-29 TPCS8004 Thermal Characteristics Characteristics Thermal resistance, channel to ambient (t = 10 s) (Note 2a) Thermal resistance, channel to ambient (t = 10 s) (Note 2b) Symbol Rth (ch-a) Rth (ch-a) Max 83.3 208 Unit C/W C/W Marking (Note 5) Part No. (or abbreviation code) S8004 Lot No. Note 6 Note 1: Note 2: a) Ensure that the channel temperature does not exceed 150C. Device mounted on a glass-epoxy board (a) FR-4 25.4 x 25.4 x 0.8 (unit: mm) b) Device mounted on a glass-epoxy board (b) FR-4 25.4 x 25.4 x 0.8 (unit: mm) Note 3: VDD = 50 V, Tch = 25C (initial), L = 1.0 mH, RG = 25 , IAR = 1.3 A Note 4: Repetitive rating: pulse width limited by maximum channel temperature Note 5: on lower right of the marking indicates Pin 1. Weekly code: (Three digits) Week of manufacture (01 for the first week of a year: sequential number up to 52 or 53) Year of manufacture (The last digit of a year) Note 6: A line under a Lot No. identifies the indication of product Labels. Not underlined: [[Pb]]/INCLUDES > MCV Underlined: [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]] Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 2 2009-09-29 TPCS8004 Electrical Characteristics (Ta = 25C) Characteristics Gate leakage current Drain cut-OFF current Drain-source breakdown voltage Gate threshold voltage Drain-source ON resistance Forward transfer admittance Input capacitance Reverse transfer capacitance Output capacitance Rise time Turn-ON time Switching time Fall time Turn-OFF time Total gate charge (gate-source plus gate-drain) Gate-source charge Gate-drain ("miller") charge tf toff Qg Qgs Qgd Symbol IGSS IDSS V (BR) DSS Vth RDS (ON) |Yfs| Ciss Crss Coss tr VGS ton ID = 0.6 A VOUT RL = 167 4.7 VDS = 10 V, VGS = 0 V, f = 1 MHz Test Condition VGS = 16 V, VDS = 0 V VDS = 200 V, VGS = 0 V ID = 10 mA, VGS = 0 V VDS = 10 V, ID = 1 mA VGS = 10 V, ID = 0.6 A VDS = 10 V, ID = 0.6 A Min 200 1.5 0.9 VDD 160 V, VGS = 10 V, - ID = 1.3 A Typ. 0.56 1.8 380 40 140 4.5 12 23 54 12 8 4 Max 10 100 3.5 0.8 ns nC nC nC Unit A A V V S pF pF pF 10 V 0V VDD 100 V - Duty < 1%, tw = 10 s = Source-Drain Ratings and Characteristics (Ta = 25C) Characteristics Drain reverse current (pulse) Forward voltage (diode) Reverse recovery time Reverse recovery charge (Note 1) Symbol IDRP VDSF trr Qrr Test Condition IDR = 1.3 A, VGS = 0 V IDR = 1.3 A, VGS = 0 V, dIDR/dt = 100 A/s Min Typ. 89 230 Max 5.2 -2.0 Unit A V ns nC 3 2009-09-29 TPCS8004 ID - VDS 5 10 4.8 4 8 6 4.6 4.4 3 4.2 2 Common source Ta = 25C Pulse test 5 10 8 4 6 ID - VDS 4.8 Common source Ta = 25C Pulse test 4.6 4.4 3 4.2 2 Drain current ID (A) 4 3.8 Drain current ID (A) 4 3.8 VGS = 3.6 V 1 VGS = 3.6 V 1 0 0 10 20 30 40 0 0 2 4 6 8 10 Drain-source voltage VDS (V) Drain-source voltage VDS (V) ID - VGS 5 Common source VDS = 10 V Pulse test 3.0 VDS - VGS Common source Ta = 25C Pulse test 4 Drain current ID (A) VDS (V) Drain-source voltage 2.5 2.0 3 1.5 ID = 2.6 A 2 25C 1 1.0 1.3 0.5 0.6 0.32 4 8 12 16 20 Ta = 100C -55C 0 0 1 2 3 4 5 0 0 Gate-source voltage VGS (V) Gate-source voltage VGS (V) |Yfs| - ID 7 5 Common source VDS = 10 V Pulse test Ta = -55C RDS (ON) - ID 5 Common source Ta = 25C Pulse test (S) 3 () Forward transfer admittance Yfs 1 Drain-source on resistance RDS (ON) 100C 25C 3 1 VGS = 10 V 0.5 0.3 15 V 0.5 0.3 0.1 0.1 0.05 0.05 0.1 0.3 0.5 1 3 5 0.05 0.05 0.1 0.3 0.5 1 3 5 Drain current ID (A) Drain current ID (A) 4 2009-09-29 TPCS8004 RDS (ON) - Ta () 1.2 Common source 1.0 Pulse test 0.65 A ID = 0.32 A 1.3 A 5 10 Common source Ta = 25C Pulse test IDR - VDS Drain-source ON resistance RDS (ON) (A) Drain reverse current IDR 3 0.8 0 0.4 VGS = 10 V 0.2 1 0.5 0.3 VGS = 10 V 5V 0 -80 -40 0 40 80 120 160 0.1 -0.03 -0.05 3V -0.1 -0.3 -0.5 0, -1 V -1 -3 Ambient temperature Ta (C) Drain-source voltage VDS (V) Capacitance - VDS 1000 Ciss 5 Common source VDS = 10 V ID = 1 mA Pulse test Vth - Ta Vth (V) Gate threshold voltage 4 (pF) 100 Coss 3 Capacitance C 2 10 Crss 1 1 0.1 Common source Ta = 25C f = 1MHz VGS = 0 V 1 10 100 0 -80 -40 0 40 80 120 160 Ambient temperature Ta (C) Drain-source voltage VDS (V) PD - Ta 2.0 (1) Device mounted on a glass-epoxy board (a) (Note 2a) (2) Device mounted on a glass-epoxy board (b) (Note 2b) t = 10 s 160 Dynamic input/output characteristics 16 40 120 80 VDD = 160 V 80 VGS Common source 40 ID = 1.3 A Ta = 25 C 4 8 12 Drain power dissipation PD (W) (V) 1.6 (1) Drain-source voltage 0.8 (2) 0.4 0 0 40 80 120 160 200 0 0 4 8 12 16 0 Ambient temperature Ta (C) Total gate charge Qg (nC) 5 2009-09-29 Gate-source voltage 1.2 VGS (V) VDS VDS TPCS8004 rth - tw 500 rth (C/W) 300 (1) Device mounted on a glass-epoxy board (a) (Note 2a) (2) Device mounted on a glass-epoxy board (b) (Note 2b) t = 10 s (2) 100 50 30 (1) Normalized transient thermal impedance 10 5 3 1 0.5 0.3 Single pulse 0.1 1m 10 m 100 m 1 10 100 1000 Pulse width tw (S) Safe operating area 10 5 3 1 ID max (pulse) * 1.2 EAS - Tch Avalanche energy EAS (mJ) 1 ms * 1.0 Drain current ID (A) 0.5 0.3 0.1 0.05 0.03 0.01 0.005 * Single pulse Ta = 25C 0.003 Curves must be derated linearly with increase in temperature. 0.001 0.1 0.3 1 3 10 0.8 10 ms * 0.6 0.4 0.2 VDSS max 30 100 300 1000 0 25 50 75 100 125 150 Channel temperature (initial) Tch (C) Drain-source voltage VDS (V) 15 V -15 V BVDSS IAR VDD VDS Test circuit Wave form Tch = 25C (Initial) B VDSS 1 2 Peak IAR = 1.3 A, RG = 25 E AS = 2 L I B VDSS - VDD VDD = 50 V, L = 1 mH 6 2009-09-29 TPCS8004 RESTRICTIONS ON PRODUCT USE * Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively "Product") without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission. * Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS. * Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact ("Unintended Use"). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document. * Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part. * Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. * The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. * ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT. * Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. * Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 7 2009-09-29 |
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